SUPER105-JA70 Solder Paste
SUPER105-JA70 is a lead-free no-clean solder paste. The viscosity stablity is good and is easy to transport, storage and use. It has well fine pitch printing properties, and can be printed in fine shapes. It has a well anti collapsing property, and can effectively inhibit the bridging or solder balls. Product with high activity and can be widely applied.
PRODUCT Info
Yik Shing Tat's recommendation, the most cost-effective alloy composition for solder pastes: Sn-1.0Ag-0.5Cu.
| Type | Alloy Composition | Powder Size | Melting Point | Density | Lead | Halogen |
| SUPER105-JA70-T3 | Sn-1.0Ag-0.5Cu | Type 3 | 217~221 | 7.4±0.05 g/cm3 | Lead-free | Halogen-free |
| SUPER105-JA70-T4 | Sn-1.0Ag-0.5Cu | Type 4 | 217~221 | 7.4±0.05 g/cm3 | Lead-free | Halogen-free |